BYD, the world’s largest electric vehicle maker, unveiled the Xuanji A3 chip at its Shenzhen headquarters on May 28, 2026, calling it China’s most powerful automotive-grade 4 nanometer chip designed for self-driving cars [1, 2, 3, 4, 5]. The chip consumes 20% less power than comparable semiconductors, offering best-in-industry energy efficiency [1, 2, 3, 4].

The Xuanji A3 is the core of BYD’s new laptop-sized central computing platform. This system integrates control over smart cockpit functions, advanced driver-assistance, and the vehicle’s electric propulsion [1, 2, 3, 4]. BYD CEO Wang Chuanfu said the chip and platform enable affordable electric vehicles to carry smart driving features previously limited to luxury models. "Even the affordable Seagull or Dolphin models can be equipped with the smart driving experience that usually goes with luxury cars. Our add-on package is the most sincere in the industry, priced only at cost," Wang said [2].

BYD plans to fit its partially automated driver-assist system—backed by LiDAR laser-mapping sensors—across all its models in China, including mass-market vehicles like the Seagull hatchback priced around 69,800 yuan (~S$13,000) [1, 2, 3, 4]. The advanced driver-assistance will be a paid add-on costing 12,000 yuan, which BYD sees as a new revenue stream amid fierce price competition in the EV sector [1, 2, 3, 4].

BYD has faced falling sales for eight straight months and intense competition in smart driving and charging technologies [1, 2, 3, 4, 5]. The company awaits formal legislation from China expected as soon as 2027 to allow consumer-facing deployment of self-driving vehicles. BYD plans a rollout of more advanced autonomy products once regulations permit [1, 2, 3, 4].

The Xuanji A3 chip joins a global race in semiconductor technology. Taiwan Semiconductor Manufacturing Company currently leads with a 2nm node, while Huawei produces 7nm chips and has pledged 1.4nm chips by 2031 [4, 5].

BYD’s shares climbed as much as 3% in early Hong Kong trading on May 29 following the announcement of the chip and related plans [1, 2, 3].