Apple has started test runs of iPhone, iPad, and Mac processors using Intel's 18A-P manufacturing process targeting low-end and legacy devices in 2026 [1, 2, 3, 4]. The 18A-P process is an update of Intel's 18A technology and incorporates advanced features such as Foveros packaging [1, 2, 3, 4]. Around 80% of the Intel-produced chips will be for iPhone models, reflecting the device sales mix [1, 2, 3, 4].

Apple plans to conduct small volume testing of these chips throughout 2026, with volume production expected to start in 2027 and increase in 2028 before declining in 2029 [1, 2, 3, 4]. Intel aims to achieve chip yield rates of 50–60% or more by 2027, though yield and mass production scale remain uncertain [2, 3, 4].

Despite Intel's involvement, TSMC will continue to produce over 90% of Apple's processors, focusing on higher-end products. Ming-Chi Kuo noted, "TSMC would still manufacture 90 percent of Apple's processors, even if Intel's initial shipments go smoothly" [1]. Analyst 郭明錤 added that TSMC's dominant role in Apple's high-end chip supply remains "relatively stable in the short term" [4].

Apple is working with Intel partly to diversify its chip manufacturing and reduce dependency on TSMC, especially as TSMC increasingly prioritizes capacity for AI and high-performance computing chips [1, 5, 3, 4]. Meanwhile, Intel's advanced packaging technology EMIB is being tested by other chipmakers like SK Hynix, who are exploring alternatives due to tight TSMC CoWoS packaging capacity driven by AI chip demand [6, 7, 8, 9]. Intel's EMIB offers ~30-40% cost savings compared to TSMC's CoWoS and achieves high silicon utilization of about 90%, though it still faces challenges in yield and ecosystem maturity compared to TSMC's packaging [10, 11]. Analyst 陸行之 said that "Intel's EMIB and Foveros advanced packaging are not multiple generations behind TSMC, and Intel's geopolitical advantages, silicon utilization, and lower costs help it secure some foundry share" [10].

The U.S. government holds a 10% stake in Intel and has encouraged Apple to diversify its foundry suppliers away from sole reliance on TSMC [1, 7].

Apple and Intel will continue small-volume testing of the 18A-P chips throughout 2026, targeting volume production to begin in 2027 with yield improvement efforts underway [1, 2, 3, 4].