Japanese semiconductor company Rapidus plans to sign memorandums of understanding (MoUs) on semiconductor research and development cooperation with the UK Semiconductor Centre and Italy's Fondazione Chips-IT. The agreements will focus on collaboration in advanced semiconductor technologies, manufacturing, and access rights to technical information [1, 2, 3].
The signing is scheduled to coincide with Japanese Prime Minister Sanae Takaichi's Europe visit starting June 13, during which she will travel to the UK and Italy. Rapidus President Atsuyoshi Koike met Takaichi on June 11 in Tokyo to brief her on the upcoming collaboration plans [1, 4, 3, 5]. Koike said, "We will work hand-in-hand with Europe to make the first step toward the discovery of a new world and new technologies that have never been seen before" [1]. The Prime Minister added she aims to "promote (related efforts), mainly among like-minded nations" and personally will engage in promotion during the trip [1, 4].
Rapidus aims to start mass production of 2-nanometer semiconductor chips in fiscal 2027 at its Hokkaido factory as part of its cutting-edge manufacturing plans [1, 2, 3]. The Japanese government supports these efforts, having pledged around 2.4 trillion yen (approximately $15 billion) in funding support [1, 3].
Meanwhile, Rapidus is negotiating with over 60 companies, mostly based in the United States, to secure clients for its products [1, 2, 3]. Japan and Italy are also looking to enhance cooperation on semiconductor design and development, including expanding collaboration between Rapidus and Italian semiconductor design firms [4, 5].
Prime Minister Takaichi will attend the G7 summit in France starting June 15 and plans bilateral talks with leaders in the UK and Italy during her trip [4, 5].
The MoU signings with the UK Semiconductor Centre and Fondazione Chips-IT are expected shortly after her arrival in Europe on June 13.
